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Product information
DANFLAT™
DANFLAT™series can be applied as an agent for electrolytic plating to improve leveling, properties and throwing power.
| Product name | For copper plating | For zinc plating | Appearance | pH(5%sol) | Ionic character |
|---|---|---|---|---|---|
| LP-1 | ○ | - | Pale yellow liquid | About 2 to 4 | Cationic |
| LP-5 | ○ | ○ | |||
| LP-7 | - | ○ | |||
| LP-8 | ○ | - |
Evaluation for leveling property
- With DANFLAT™
- Without DANFLAT™
- *Please use our products after checking the use conditions with preliminary tests.
- Please contact us for more information.
